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1.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Investigation of pulsations of the operating temperature in a miniature loop heat pipe / S. V. Vershinin, Yu. F. Maydanik // International Journal of Heat and Mass Transfer. - 2007. - Vol.50, №25-26. - С. 5232-5240
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- PULSATION HEAT -- HIGH-TEMPERATURE SUPERCONDUCTOR

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2.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Investigation of pulsations of the operating temperature in a miniature loop heat pipe / S. V. Vershinin, Yu. F. Maydanik // International Journal of Heat and Mass Transfer. - 2007. - Vol.50, №25-26. - С. 5232-5240
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- PULSATION HEAT -- HIGH-TEMPERATURE SUPERCONDUCTOR

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3.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Hysteresis phenomena in loop heat pipes / S. V. Vershinin, Yu. F. Maydanik // Applied Thermal Engineering. - 2007. - Vol.27, №5-6. - С. 962-968
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- CAPILLARY METHOD -- EVAPORATION
Аннотация: Testing of loop heat pipes (LHPs) has shown that the heat-load dependence of the operating temperature is not always unambiguous. It may have a hysteresis nature. It has been found that temperature hysteresis is connected with changes in the liquid distribution between the compensation chamber (CC) and the condenser. Analysis makes it possible to distinguish three types of temperature hysteresis. In the first case this redistribution is caused by the change in the amount of the parasitic heat flow that penetrates into the CC, which in its turn is a result of heat-transfer hysteresis in the evaporation zone. In the second, temperature hysteresis is connected with the liquid metastable state, which leads to a delay of formation of the vapor phase in the compensation chamber. The reason for hysteresis of the third type is the change of the initial liquid distribution in an LHP during a start-up

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4.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Hysteresis phenomena in loop heat pipes / S. V. Vershinin, Yu. F. Maydanik // Applied Thermal Engineering. - 2007. - Vol.27, №5-6. - С. 962-968
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- CAPILLARY METHOD -- EVAPORATION
Аннотация: Testing of loop heat pipes (LHPs) has shown that the heat-load dependence of the operating temperature is not always unambiguous. It may have a hysteresis nature. It has been found that temperature hysteresis is connected with changes in the liquid distribution between the compensation chamber (CC) and the condenser. Analysis makes it possible to distinguish three types of temperature hysteresis. In the first case this redistribution is caused by the change in the amount of the parasitic heat flow that penetrates into the CC, which in its turn is a result of heat-transfer hysteresis in the evaporation zone. In the second, temperature hysteresis is connected with the liquid metastable state, which leads to a delay of formation of the vapor phase in the compensation chamber. The reason for hysteresis of the third type is the change of the initial liquid distribution in an LHP during a start-up

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5.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Effect of the thermal contact resistance on heat-transfer during boiling from fine porous capillary structures / S. V. Vershinin, Y. G. Fershtater, Yu. F. Maydanik // High Temperature. - 1992. - Vol.30, №4. - С. 668-673
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
HEAT TRAHSFER -- VAPOR FORMATION
Аннотация: The dependence of the heat transfer rate on the geometry of vapor channels is investigated analytically and experimentally with a consideration of the thermal contact resistance during vapor formation in fine porous structures for carrying away the vapor. It is shown that the larger the contact resistance, the greater the distance between the channels must be to maximize the values of the heat-transfer coefficients

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6.
Инвентарный номер: нет.
   
   V 50


    Vershinin, S. V.
    Effect of the thermal contact resistance on heat-transfer during boiling from fine porous capillary structures / S. V. Vershinin, Y. G. Fershtater, Yu. F. Maydanik // High Temperature. - 1992. - Vol.30, №4. - С. 668-673
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
HEAT TRAHSFER -- VAPOR FORMATION
Аннотация: The dependence of the heat transfer rate on the geometry of vapor channels is investigated analytically and experimentally with a consideration of the thermal contact resistance during vapor formation in fine porous structures for carrying away the vapor. It is shown that the larger the contact resistance, the greater the distance between the channels must be to maximize the values of the heat-transfer coefficients

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7.
Инвентарный номер: нет.
   
   T 44


   
    The proof-of-feasibility of multiple evaporator loop heat pipes / W. B. Bienert, D. A. Wolf, M. N. Nikitkin, Yu. F. Maydanik, Y. G. Fershtater, S. V. Vershinin, J. M. Gottschlich // 6th European Symposium on Space Environmental Control Systems: Noordwijk, Netherlands, 20-22 may 1997 . - 1997. - Vol.400. - С. 393-398
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPES -- THERMAL CONTROL -- MULTIPLE THERMAL INTERFACE
Аннотация: This paper presents results that demonstrate the proof-of-feasibility of multiple evaporator Loop Heat Pipes (LHP). It was demonstrated that a multiple evaporator LHP can successfully operate as a thermal control system component. A breadboard LHP with multiple evaporators (two) that retained the reliable self starting behavior of the single thermal interface LHP was developed. Program efforts were concentrated on a two pump system and investigated the performance of the dual evaporator LHP. Analytical predictons and experimental test data are compared, and important issues are discussed that will be a baseline for continued development of multiple thermal interface LHPs. All of the conclusions are based on test results, analytic modeling and the correlation of the two. Although a mathematical model that predicts the multiple evaporator LHP behavior was developed, the primary focus of the program was the development, fabrication, and test of a breadboard multi-evaporator LHP. The program clearly demonstrated that multi-evaporator LHPs are feasible and merit further development as a viable thermal control components

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8.
Инвентарный номер: нет.
   
   T 44


   
    The proof-of-feasibility of multiple evaporator loop heat pipes / W. B. Bienert, D. A. Wolf, M. N. Nikitkin, Yu. F. Maydanik, Y. G. Fershtater, S. V. Vershinin, J. M. Gottschlich // 6th European Symposium on Space Environmental Control Systems: Noordwijk, Netherlands, 20-22 may 1997 . - 1997. - Vol.400. - С. 393-398
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPES -- THERMAL CONTROL -- MULTIPLE THERMAL INTERFACE
Аннотация: This paper presents results that demonstrate the proof-of-feasibility of multiple evaporator Loop Heat Pipes (LHP). It was demonstrated that a multiple evaporator LHP can successfully operate as a thermal control system component. A breadboard LHP with multiple evaporators (two) that retained the reliable self starting behavior of the single thermal interface LHP was developed. Program efforts were concentrated on a two pump system and investigated the performance of the dual evaporator LHP. Analytical predictons and experimental test data are compared, and important issues are discussed that will be a baseline for continued development of multiple thermal interface LHPs. All of the conclusions are based on test results, analytic modeling and the correlation of the two. Although a mathematical model that predicts the multiple evaporator LHP behavior was developed, the primary focus of the program was the development, fabrication, and test of a breadboard multi-evaporator LHP. The program clearly demonstrated that multi-evaporator LHPs are feasible and merit further development as a viable thermal control components

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9.
Инвентарный номер: нет.
   
   S 82


   
    Steady state operation of a copper–water LHP with a flat-oval evaporator / S. Becker, S. V. Vershinin, V. Sartre, E. Laurien, J. Bonjour, Yu. F. Maydanik // Applied Thermal Engineering. - 2011. - Vol.31, №5. - С. 686-695. - Библиогр.: с. 695 (24 ref.)
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- HEAT TRAHSFER -- EXPERIMENTAL STUDY
Аннотация: In order to dissipate the heat generated by electronic boxes in avionic systems, a copper–water LHP with a flat-oval evaporator was fabricated and tested at steady state. The LHP consists of a flat shaped evaporator, 7 mm thick, including compensation chamber with attached heat exchanger. The condenser is cooled by forced convection of liquid. The variable parameters are the heat sink and ambient temperatures (20 and 55 °C), the orientation (−90° to +90° in two perpendicular planes) and the power input (0–100 W). Evaporator wall temperatures are higher when the evaporator is placed above the condenser. For heat sink and ambient temperature of 20 °C the evaporator wall temperature does not vary much with heat load for all measured elevations. But it fluctuates at heat sink and ambient temperature equal to 55 °C when the evaporator is placed below the condenser. The LHP total thermal resistance is governed by the condenser resistance. It decreases with increasing heat load, whatever the operating conditions, because the part of the condenser internal surface area used for condensation increases too. A minimum thermal resistance of 0.2 K/W was obtained. The maximum thermal resistance was 2.7 K/W

\\\\expert2\\NBO\\Applied Thermal Engineering\\2011, v. 31, p.686.pdf
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10.
Инвентарный номер: нет.
   
   S 82


   
    Steady state operation of a copper–water LHP with a flat-oval evaporator / S. Becker, S. V. Vershinin, V. Sartre, E. Laurien, J. Bonjour, Yu. F. Maydanik // Applied Thermal Engineering. - 2011. - Vol.31, №5. - С. 686-695. - Библиогр.: с. 695 (24 ref.)
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- HEAT TRAHSFER -- EXPERIMENTAL STUDY
Аннотация: In order to dissipate the heat generated by electronic boxes in avionic systems, a copper–water LHP with a flat-oval evaporator was fabricated and tested at steady state. The LHP consists of a flat shaped evaporator, 7 mm thick, including compensation chamber with attached heat exchanger. The condenser is cooled by forced convection of liquid. The variable parameters are the heat sink and ambient temperatures (20 and 55 °C), the orientation (−90° to +90° in two perpendicular planes) and the power input (0–100 W). Evaporator wall temperatures are higher when the evaporator is placed above the condenser. For heat sink and ambient temperature of 20 °C the evaporator wall temperature does not vary much with heat load for all measured elevations. But it fluctuates at heat sink and ambient temperature equal to 55 °C when the evaporator is placed below the condenser. The LHP total thermal resistance is governed by the condenser resistance. It decreases with increasing heat load, whatever the operating conditions, because the part of the condenser internal surface area used for condensation increases too. A minimum thermal resistance of 0.2 K/W was obtained. The maximum thermal resistance was 2.7 K/W

\\\\expert2\\NBO\\Applied Thermal Engineering\\2011, v. 31, p.686.pdf
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