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Формат представления найденных документов:
полныйинформационныйкраткий
Отсортировать найденные документы по:
авторузаглавиюгоду изданиятипу документа
Поисковый запрос: (<.>K=CPU<.>)
Общее количество найденных документов : 8
Показаны документы с 1 по 8
1.
Инвентарный номер: нет.
   
   M 73

   
    Miniature loop heat pipes for electronics cooling / V. G. Pastukhov, Yu. F. Maydanik, S. V. Vershinin, M. A. Korukov // Applied Thermal Engineering : 12th International Heat Pipe Conference Location, Russia, 19-24 may 2002 . - 2003. - Vol.23, № 9. - С. 1125-1135
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
MINIATURE LOOP HEAT PIPE -- CPU -- THERMAL RESISTANCE
Аннотация: The paper is devoted to the development of miniature loop heat pipes (mLHPs) with a nominal capacity of 25-30 W and a heat-transfer distance up to 250 mm intended for cooling electronics components and CPU of mobile PC. It gives the results of investigating several prototypes of mLHPs incorporated into remote heat exchanger (RHE) systems in different conditions. It has been established that in the nominal range of heat loads orientation does not practically affect the mLHPs operating characteristics. Under air cooling the total thermal resistance of such a system is 1.7-4.0degreesC/W and depends strongly on the cooling conditions and the radiator efficiency. In this case the mLHP's own thermal resistance is in the limits from 0.3 to 1.2degreesC/W, and the maximum capacity reaches 80-120 BT. The obtained results make it possible to regard mLHPs as quite promising devices for RHE systems providing thermal regimes for electronics components and personal computers. (C) 2003 Elsevier Science Ltd. All rights reserved

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2.
Инвентарный номер: нет.
   
   L 88

   
    Loop Heat Pipes for Cooling Systems of Servers / Yu. F. Maydanik, S. V. Vershinin, V. G. Pastukhov, S. Fried // IEEE Transactions on Components and Packaging Technologies. - 2010. - Vol.33, №2. - С. 416-423
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
HEAT-TRANSFER DEVICE -- LHPs -- OPTERON CPUs
Аннотация: Loop heat pipes (LHPs) are exceptionally efficient heat-transfer devices that employ a closed loop evaporation-condensation cycle that can be used to cool densely packed electronic systems that reject large quantities of heat, including computers and their central processing units (CPUs). Tests were carried out on miniature ammonia LHPs with a CPU thermal simulator using different ways of condenser cooling. The possibility of maintaining the cooled object temperatures between 40°C and 70°C with heat load changing from 100 to 320 W was demonstrated. Subsequent tests of these devices in a 1U computer with dual core advanced micro devices Opteron CPUs, dissipating between 95 and 120 W, have confirmed the advantages and heat transfer efficiency of LHP-based cooling systems used to cool CPU in 1U chassis

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3.
Инвентарный номер: нет.
   
   P 31

    Pastukhov, V. G.
    Low-noise cooling system for PC on the base of loop heat pipes / V. G. Pastukhov, Yu. F. Maydanik // Applied Thermal Engineering. - 2007. - Vol.27, №5-6. - С. 894-901
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
COMPUTER COOLING -- LOOP HEAT PIPE -- PASSIVE CPU COOLING SYSTEM
Аннотация: The problem of current importance connected with a wide use of personal computers (PC) and a rapid growth of their performance is a decrease in the noise level created at the operation of cooling system fans. One of the possible ways of solving this problem may be the creation of passive or semi-passive systems on the base of loop heat pipes (LHPs) in which the heat sink is an external radiator cooled by natural and/or forced air convection. The paper presents the results of development and tests of several variants of such systems, which are capable of sustaining an operating temperature of 72–78 °C on the heat source thermal interface which dissipates 100 W at an ambient temperature of 22 °C. It is also shown that the use of additional means of active cooling in combination with LHPs allows to increase the value of dissipated heat up to 180 W and to decrease the system thermal resistance down to 0.29 °C/W

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4.
Инвентарный номер: нет.
   
   P 31

    Pastukhov, V. G.
    Active coolers based on copper–water LHPs for desktop PC / V. G. Pastukhov, Yu. F. Maydanik // Applied Thermal Engineering. - 2009. - Vol.29, №14-15. - С. 3140-3143
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- COOLER -- THERMAL RESISTANCE
Аннотация: The paper is devoted to the development of active coolers for central processing units (CPU) of desktop computers on the basis of copper–water loop heat pipes (LHP). It presents descriptions of designs and test results for two cooler models containing flat evaporators and condensers of the collector type equipped with a heat sink (radiator). Heat was removed from the radiators by forced convection. It is shown that the maximum heat-transfer capacity of the coolers was 500–600 W. Minimum values of the total thermal resistance of the coolers were equal to 0.15–0.17 °С/W at heat loads of 500 and 250 W, respectively. On the basis of an analysis of distribution of local thermal resistances it has been concluded that additional decrease in the thermal resistance required for cooling a CPU with a generated thermal capacity in excess of 150 W can be achieved at the cost of optimization of radiator design and (or) an increase in the intensity of its cooling

Найти похожие
5.
Инвентарный номер: нет.
   
   M 73

   
    Miniature loop heat pipes for electronics cooling / V. G. Pastukhov, Yu. F. Maydanik, S. V. Vershinin, M. A. Korukov // Applied Thermal Engineering : 12th International Heat Pipe Conference Location, Russia, 19-24 may 2002 . - 2003. - Vol.23, № 9. - С. 1125-1135
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
MINIATURE LOOP HEAT PIPE -- CPU -- THERMAL RESISTANCE
Аннотация: The paper is devoted to the development of miniature loop heat pipes (mLHPs) with a nominal capacity of 25-30 W and a heat-transfer distance up to 250 mm intended for cooling electronics components and CPU of mobile PC. It gives the results of investigating several prototypes of mLHPs incorporated into remote heat exchanger (RHE) systems in different conditions. It has been established that in the nominal range of heat loads orientation does not practically affect the mLHPs operating characteristics. Under air cooling the total thermal resistance of such a system is 1.7-4.0degreesC/W and depends strongly on the cooling conditions and the radiator efficiency. In this case the mLHP's own thermal resistance is in the limits from 0.3 to 1.2degreesC/W, and the maximum capacity reaches 80-120 BT. The obtained results make it possible to regard mLHPs as quite promising devices for RHE systems providing thermal regimes for electronics components and personal computers. (C) 2003 Elsevier Science Ltd. All rights reserved

Найти похожие
6.
Инвентарный номер: нет.
   
   L 88

   
    Loop Heat Pipes for Cooling Systems of Servers / Yu. F. Maydanik, S. V. Vershinin, V. G. Pastukhov, S. Fried // IEEE Transactions on Components and Packaging Technologies. - 2010. - Vol.33, №2. - С. 416-423
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
HEAT-TRANSFER DEVICE -- LHPs -- OPTERON CPUs
Аннотация: Loop heat pipes (LHPs) are exceptionally efficient heat-transfer devices that employ a closed loop evaporation-condensation cycle that can be used to cool densely packed electronic systems that reject large quantities of heat, including computers and their central processing units (CPUs). Tests were carried out on miniature ammonia LHPs with a CPU thermal simulator using different ways of condenser cooling. The possibility of maintaining the cooled object temperatures between 40°C and 70°C with heat load changing from 100 to 320 W was demonstrated. Subsequent tests of these devices in a 1U computer with dual core advanced micro devices Opteron CPUs, dissipating between 95 and 120 W, have confirmed the advantages and heat transfer efficiency of LHP-based cooling systems used to cool CPU in 1U chassis

Найти похожие
7.
Инвентарный номер: нет.
   
   P 31

    Pastukhov, V. G.
    Low-noise cooling system for PC on the base of loop heat pipes / V. G. Pastukhov, Yu. F. Maydanik // Applied Thermal Engineering. - 2007. - Vol.27, №5-6. - С. 894-901
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
COMPUTER COOLING -- LOOP HEAT PIPE -- PASSIVE CPU COOLING SYSTEM
Аннотация: The problem of current importance connected with a wide use of personal computers (PC) and a rapid growth of their performance is a decrease in the noise level created at the operation of cooling system fans. One of the possible ways of solving this problem may be the creation of passive or semi-passive systems on the base of loop heat pipes (LHPs) in which the heat sink is an external radiator cooled by natural and/or forced air convection. The paper presents the results of development and tests of several variants of such systems, which are capable of sustaining an operating temperature of 72–78 °C on the heat source thermal interface which dissipates 100 W at an ambient temperature of 22 °C. It is also shown that the use of additional means of active cooling in combination with LHPs allows to increase the value of dissipated heat up to 180 W and to decrease the system thermal resistance down to 0.29 °C/W

Найти похожие
8.
Инвентарный номер: нет.
   
   P 31

    Pastukhov, V. G.
    Active coolers based on copper–water LHPs for desktop PC / V. G. Pastukhov, Yu. F. Maydanik // Applied Thermal Engineering. - 2009. - Vol.29, №14-15. - С. 3140-3143
ББК 53
Рубрики: ФИЗИКА
Кл.слова (ненормированные):
LOOP HEAT PIPE -- COOLER -- THERMAL RESISTANCE
Аннотация: The paper is devoted to the development of active coolers for central processing units (CPU) of desktop computers on the basis of copper–water loop heat pipes (LHP). It presents descriptions of designs and test results for two cooler models containing flat evaporators and condensers of the collector type equipped with a heat sink (radiator). Heat was removed from the radiators by forced convection. It is shown that the maximum heat-transfer capacity of the coolers was 500–600 W. Minimum values of the total thermal resistance of the coolers were equal to 0.15–0.17 °С/W at heat loads of 500 and 250 W, respectively. On the basis of an analysis of distribution of local thermal resistances it has been concluded that additional decrease in the thermal resistance required for cooling a CPU with a generated thermal capacity in excess of 150 W can be achieved at the cost of optimization of radiator design and (or) an increase in the intensity of its cooling

Найти похожие
 
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